Polymatech Expands Global Footprint With Singapore CoB Packaging Plant

CW Bureau ·

Chennai-based Polymatech Electronics Ltd has expanded its global manufacturing presence with the inauguration of an advanced electronics manufacturing facility in Singapore through its wholly owned subsidiary, AEIM Pte Ltd.

The company has committed an investment of approximately $25 million (S$32 million) in the facility, which will serve as Polymatech’s Asia-Pacific manufacturing hub for LED Chip-on-Board (CoB) packaging and advanced memory module assembly.

The facility, located at Kallang Way, is positioned as one of Singapore’s first dedicated commercial-scale LED Chip-on-Board packaging units and is expected to generate around 50 high-value engineering and manufacturing jobs over the next five years.

Asia-Pacific manufacturing hub
The official launch ceremony was attended by representatives from the Singapore Economic Development Board (EDB), technology partners from Japan, Malaysia, France, the United States and Singapore, along with industry stakeholders from the semiconductor and advanced manufacturing sectors.

Founded in Chennai in 2007, Polymatech Electronics has completed 19 years of operations in semiconductor packaging, opto-electronics and advanced electronics manufacturing. The company said the Singapore facility marks a significant step in its international expansion strategy.

Facility capabilities
The manufacturing unit is equipped with advanced dispensing, packaging, curing, inspection, testing and module assembly systems designed for high-precision electronics production and specialised LED Chip-on-Board applications.

The facility will support two key manufacturing segments: LED Chip-on-Board packaging for UV, IR and full-spectrum LED products catering to horticulture, medical, industrial inspection and specialised OEM applications. Also, it will host advanced memory module assembly for high-performance computing, enterprise systems, industrial electronics and embedded technology applications.

According to the company, the facility enhances Singapore’s semiconductor value chain by adding specialised opto-electronics packaging and advanced electronics assembly capabilities.

Strategic expansion
Polymatech said its growing international customer base and expanding product portfolio necessitated the creation of a regional manufacturing and operations hub capable of serving global markets with greater efficiency and supply-chain resilience.

The company selected Singapore due to its strategic location within Asia’s semiconductor ecosystem, strong logistics infrastructure, intellectual property framework, advanced manufacturing support ecosystem and access to skilled engineering talent.

Statement of strength
AEIM Pte Ltd, Managing Director, Eswara Rao Nandam, said, “The opening of our Singapore facility is a statement of strength and intent, and a defining milestone in Polymatech’s journey from an Indian semiconductor and advanced electronics manufacturer to a globally integrated enterprise. Singapore becomes the Asia-Pacific anchor of a supply chain that now spans five countries and four continents — from sapphire crystal growth in France to advanced packaging operations here in Singapore.”

EDB welcomes investment
Singapore Economic Development Board (EDB), Vice President, Global Enterprise Division, Ng Ming Liang, said, “Polymatech’s new Singapore facility is a testament to our robust semiconductor ecosystem. Singapore offers a skilled talent pool, well-connected supply chain infrastructure, and an industry ecosystem built through close partnerships with companies like Polymatech. We warmly welcome Polymatech to Singapore and look forward to growing together.”

The latest investment strengthens Polymatech’s international manufacturing network and underscores its ambitions to evolve into a globally integrated semiconductor and advanced electronics enterprise serving customers across Asia, Europe and North America