Tag: HIPSPL project
MANUFACTURING India’s First: Stone Laid For ₹2,000-Cr 3D Chip Packaging Facility In Odisha

In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar. The project marks a significant step towards strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end […]

CW Bureau · Apr 19, 2026